Multiobjective Design Optimization of IGBT Power Modules Considering Power Cycling and Thermal Cycling

Power Cycling Test Circuit for Thermal Fatigue Resistance Analysis of Solder Joints in IGBT

The paper will give a detailed presentation of an active power cycling test bench in high temperature conditions developed to ageing the solder between the Direct Copper Bonding (DCB) and the base of IGBT devices. The average junction temperature measurement protocol, the temperature regulation of the base plate, the acquisition of all the electrical signals, and the performance of the test cir...

Thermal Impedance Monitoring during Power Cycling Tests

In this publication a new method of thermal impedance analysis of power modules is presented. It enables a distinction of different failure mechanisms within the heat flow path by electrical measurement during power cycling tests. With measurement and evaluation of the thermal impedance Zth the degradation can be located within chip solder layer, system solder layer and thermal interface materi...

AlSiC Baseplates for Power IGBT Modules: Design, Performance and Reliability

Improved baseplate materials are required to provide superior reliability and heat transfer as IGBT power density increases. The key is for the baseplate thermal coefficient of expansion (TCE) to be matched to the module design and to have sufficient thermal conductivity (κ). Aluminum Silicon Carbide (AlSiC), a metal matrix composite material, provides a TCE that is compatible with the attachme...

Improving the power cycling performance of the emitter contact of IGBT modules: Implementation and evaluation of stitch bond layouts

The emitter (front metallization) of IGBTs is contacted by wire bonding. In this study, the influence of the wirebond layout on the power cycling performance of IGBT modules is investigated. Stitch bonding is implemented to modify the wirebond layout of the emitter contact. The different layouts are subjected to power cycling tests. For a better understanding of the experimental results, electr...

Effects of thermal cycling on aluminum metallization of power diodes